Gold Member Since 2017
Saftop Perindo (HK) Co., Limited

Potting Compound, Potting Material, COB manufacturer / supplier in China, offering High Conductivity Low Shrinkage Potting Compound for Chip Package, Ultra Light Thermal Conductive Silicone Pad Heat Sink Gap Filler 4W for PCB, High Temperature Thermal Conductive Silicone Gap Pad for PCB and so on.

(/ )

Supplier Homepage Product Thermal Silicone High Conductivity Low Shrinkage Potting Compound for Chip Package

High Conductivity Low Shrinkage Potting Compound for Chip Package

FOB Price: US $1-500 / kg
Min. Order: 5 kg
Min. Order FOB Price
5 kg US $1-500/ kg
Get Latest Price
Port: Hong Kong, Hong Kong
Production Capacity: 100 Ton
Payment Terms: L/C, T/T

Request a custom order and have something just for you!

Send Customized Request
Basic Info
  • Model NO.: DR55018
  • Structure Feature: Paste
  • Usage: Chemical Engineering, Chemical Industry Product
  • Source: Silicone
  • Shrinkage: Low Shrinkage
  • Trademark: Saftop or OEM
  • Specification: 15g, 50g, 5~20kg
  • HS Code: 3910000000
  • Material: Silicone
  • Type: Structured Packing
  • Effect: Structure and Photopermeability
  • Refractivity: Low Refractive
  • Absorbance: Low Optical Absorbance
  • Transport Package: Tube, Tank in Carton on Pallet
  • Origin: China
Product Description
High Conductivity Low Shrinkage Potting Compound for Chip Package

Features

Low shrinkagelow optical absorbancelow refractive index 
2 Easy to handle due to a one component liquid type.
3 Applied shape is well maintained..
4 Very high capability of thermal resistance.
5 Very high capability of UV light resistance.

Application

1 COB LED industry 2 Chip Package
You Might Also Like
Send your message to this supplier
Avatar
Mr. Liuanfei
*From:
To: Mr. Liuanfei
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

Find Similar Products By Category