Gold Member Since 2017
Saftop Perindo (HK) Co., Limited

Potting Compound, Potting Material, COB manufacturer / supplier in China, offering High Conductivity Low Shrinkage Potting Compound for Chip Package, High Conductivity Ultra Thin Silicone Conductive Pad Gap Filler Thermal Conductive Pad for GPU, Ultra Light Thermal Silicone Conductive Pad Heat Sink Pad 4W for PCB and so on.

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Supplier Homepage Product Thermal Silicone High Conductivity Low Shrinkage Potting Compound for Chip Package

High Conductivity Low Shrinkage Potting Compound for Chip Package

FOB Price: US $1-500 / kg
Min. Order: 5 kg
Min. Order FOB Price
5 kg US $1-500/ kg
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Production Capacity: 100 Ton
Transport Package: Tube, Tank in Carton on Pallet
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: DR55018
  • Structure Feature: Paste
  • Usage: Chemical Engineering, Chemical Industry Product
  • Source: Silicone
  • Shrinkage: Low Shrinkage
  • Trademark: Saftop or OEM
  • Origin: China
  • Material: Silicone
  • Type: Structured Packing
  • Effect: Structure and Photopermeability
  • Refractivity: Low Refractive
  • Absorbance: Low Optical Absorbance
  • Specification: 15g, 50g, 5~20kg
  • HS Code: 3910000000
Product Description
High Conductivity Low Shrinkage Potting Compound for Chip Package

Features

Low shrinkagelow optical absorbancelow refractive index 
2 Easy to handle due to a one component liquid type.
3 Applied shape is well maintained..
4 Very high capability of thermal resistance.
5 Very high capability of UV light resistance.

Application

1 COB LED industry 2 Chip Package
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