Gold Member Since 2017
Saftop Perindo (HK) Co., Limited

Thermal Paste, Silicone Grease, CPU Cooler manufacturer / supplier in China, offering Thermal Silicone Heat Sink Grease Compound Paste for LED for BGA, High Temperature Thermal Conductive Silicone Gap Pad for PCB, High Conductivitiy Silicone Rubber Gap Filler Thermal Conductive Pad and so on.

(/ )

Supplier Homepage Product Thermal paste Thermal Silicone Heat Sink Grease Compound Paste for LED for BGA

Thermal Silicone Heat Sink Grease Compound Paste for LED for BGA

FOB Price: US $0.6-30 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $0.6-30/ Piece
Get Latest Price
Production Capacity: 1000 Ton/Month
Transport Package: Tube, Tank
Payment Terms: L/C, T/T, Western Union

Request a custom order and have something just for you!

Send Customized Request
Basic Info
  • Model NO.: DR3041
  • Type: Liquid
  • Material: Rubber
  • Maximum Voltage: <10KV
  • Certification: UL, ISO9001, SGS
  • Brand: Saftop
  • MSDS: Availabe
  • Packing Weight: Customization
  • Trademark: Saftop or OEM
  • Origin: China
  • Application: Insulators, CPU Heat Sink, PCB Heat Sink, Computer Heat Sink
  • Chemistry: Heat Sink
  • Thermal Rating: H 180
  • Classification: Thermal Interface Material
  • Color: White, Gray
  • Viscosity: Customization
  • Export Lisence: Available
  • OEM: Available
  • Specification: 10g, 50g, 0.5kg, 1kg customization
  • HS Code: 3910000000
Product Description
          Thermal Silicone Heat Sink Grease Compound Paste for LED for BGA              SPECIFICATION

                                 Thermal Conductive Silicon  Grease
Serial NumberDR3041Test Standard
ColorWhite By sight
AppearancePasteBy sight
Viscosity46000mPa.sDJ-4
Rated Temperature-30-180ºCEN344
Density3.32g/ccASTM D792
Conductivity2.0W/mkASTM D5470
Heat Impedance  0.155ºC.2/WASTM D5470
Dielectric Strength≥5KV/mmASTM D149
Resistance6.2×1011Ω.cmASTM D257
Evaporation≤1%@120ºC 4hr
Solid Content99%@120ºC 4hr
Bleed0.22%@150ºC  7days
The properties is based on 25ºC 55% humidity

Features  

1 Thermal Conductivity: 2.0 W/m-K
2 Applies very low force on components during assembly
3 Low volumetric expansion
4 Excellent chemical and mechanical stability even at higher temperatures
5 No curing required
6 Stable viscosity in storage and in

 Applications

  Bare die to heat spreader lid
  Filling various gaps between heat-generating devices to heat sinks and housings
  Devices requiring low assembly pressure
  BGA, PGA, PPGA

 
Send your message to this supplier
Avatar
Mr. Liuanfei
*From:
To: Mr. Liuanfei
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

Find Similar Products By Category