Gold Member Since 2017
Saftop Perindo (HK) Co., Limited

Silicone Rubber, Silicone Sheet, Gap Filler manufacturer / supplier in China, offering High Conductivity Ultra Thin Silicone Conductive Pad Heat Sink Pad Thermal Pad for Hard Disk, Ultra Light Thermal Conductive Silicone Pad Heat Sink Gap Filler 4W for PCB, High Temperature Thermal Conductive Silicone Gap Pad for PCB and so on.

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Supplier Homepage Product Thermal Pad 3.5~6W/M*K High Conductivity Ultra Thin Silicone Conductive Pad Heat Sink Pad Thermal Pad for Hard Disk

High Conductivity Ultra Thin Silicone Conductive Pad Heat Sink Pad Thermal Pad for Hard Disk

FOB Price: Get Latest Price
Min. Order: 50 Pieces
Port: Shenzhen, China
Production Capacity: 1000000000 Pieces Per Month
Payment Terms: L/C, T/T, Western Union

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Product Catalog
Thermal Pad
18 Products
Content
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Product Name
FOB Price
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Product Attribute
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Basic Info
  • Model NO.: DR40 T13
  • Usage: Industrial, Electronics, PCB
  • Raw Materials: Natural Rubber, Pad
  • Performance: Heat Sink
  • Harndness: Customization
  • Trademark: Saftop or OEM
  • Specification: any size any shape
  • HS Code: 3824909990
  • Material: Natural Rubber
  • Feature: Impact-resistant, Heat-resistant, Insulating, Cold-resistant
  • Medium: Metal Frame Layer Rubber Sheet
  • Color: Customization
  • Thickness: Customization
  • Transport Package: Bubble Pack in Carton on Pallet
  • Origin: China
Product Description

High Conductivity Ultra Thin Silicone Conductive Pad Heat Sink Pad Thermal Pad for Hard Disk

High Conductivity Ultra Thin Silicone Conductive Pad Heat Sink Pad Thermal Pad for Hard Disk


 
High Conductivity Ultra Thin Silicone Conductive Pad Heat Sink Pad Thermal Pad for Hard Disk


Features

1 High thermal conductivity: 5.0 W/m-K
2 Highly conformable, "S-Class" softness
3 Natural inherent tack reduces
4 interfacial thermal resistance
5 Fiberglass-reinforced for puncture,
  shear and tear resistance
6 Excellent thermal performance at low pressures
 


 Applications
• CDROM / DVD ROM
• Voltage Regulator Modules (VRMs) and POLs
• Thermally enhanced BGAs
• Memory packages / modules
• PC board to chassis
• ASICs and DSPs






 
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