Gold Member Since 2017
Saftop Perindo (HK) Co., Limited

Thermal Paste, Silicone Grease, CPU Cooler manufacturer / supplier in China, offering Arctic Silver Silicone Thermal Paste Compound Grease for for CPU, High Temperature Thermal Conductive Silicone Gap Pad for PCB, High Conductivitiy Silicone Rubber Gap Filler Thermal Conductive Pad and so on.

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Supplier Homepage Product Thermal paste Arctic Silver Silicone Thermal Paste Compound Grease for for CPU

Arctic Silver Silicone Thermal Paste Compound Grease for for CPU

FOB Price: US $0.6-30 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $0.6-30/ Piece
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Port: Hong Kong, Hong Kong
Production Capacity: 1000 Ton/Month
Payment Terms: L/C, T/T, Western Union

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Basic Info
  • Model NO.: DR40 T16
  • Type: Liquid
  • Material: Rubber
  • Maximum Voltage: <10KV
  • Certification: UL, ISO9001, SGS
  • Brand: Saftop
  • MSDS: Availabe
  • Packing Weight: Customization
  • Trademark: Saftop or OEM
  • Specification: 10g, 50g, 0.5kg, 1kg customization
  • HS Code: 3910000000
  • Application: Insulators, CPU Heat Sink, PCB Heat Sink, Computer Heat Sink
  • Chemistry: Heat Sink
  • Thermal Rating: H 180
  • Classification: Thermal Interface Material
  • Color: White, Gray
  • Viscosity: Customization
  • Export Lisence: Available
  • OEM: Available
  • Transport Package: Tube, Tank
  • Origin: China
Product Description
 Arctic Silver Silicone Thermal Paste Compound Grease for for CPU
                      SPECIFICATION


                                 Thermal Conductive Silicon  Grease
Serial Number DR40 T16Test Standard
ColorDark Gray By sight
AppearancePasteBy sight
Viscosity180000mPa.sDJ-4
Rated Temperature-30-180ºCEN344
Density2.98g/ccASTM D792
Conductivity3.5W/mkASTM D5470
Heat Impedance  0.735ºC.2/WASTM D5470
Dielectric Strength≥5KV/mmASTM D149
Resistance6.2×1011Ω.cmASTM D257
Evaporation≤1%@120ºC 4hr
Solid Content99%@120ºC 4hr
Bleed0.22%@150ºC  7days
The properties is based on 25ºC 55% humidity

Features  

1 Thermal Conductivity: 3.5 W/m-K
2 Applies very low force on components during assembly
3 Low volumetric expansion
4 Excellent chemical and mechanical stability even at higher temperatures
  

 Applications

   High performance computer processors 
   High watt density applications where the lowest thermal resistance interface is required
   

 
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