Gold Member Since 2017
Saftop Perindo (HK) Co., Limited

Thermal Paste, Silicone Grease, CPU Cooler manufacturer / supplier in China, offering Gray Color Thermal Silicone Grease Heat Sink Compound for Computer, Ultra Light Thermal Conductive Silicone Pad Heat Sink Gap Filler 4W for PCB, High Temperature Thermal Conductive Silicone Gap Pad for PCB and so on.

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Supplier Homepage Product Thermal paste Gray Color Thermal Silicone Grease Heat Sink Compound for Computer

Gray Color Thermal Silicone Grease Heat Sink Compound for Computer

FOB Price: US $0.6-30 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $0.6-30/ Piece
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Port: Hong Kong, Hong Kong
Production Capacity: 1000 Ton/Month
Payment Terms: L/C, T/T, Western Union

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Thermal Grease
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Basic Info
  • Model NO.: TR3039
  • Type: Liquid
  • Material: Rubber
  • Maximum Voltage: <10KV
  • Certification: UL, ISO9001
  • Brand: Saftop
  • MSDS: Availabe
  • Packing Weight: Customization
  • Trademark: Saftop or OEM
  • Specification: 10g, 50g, 0.5kg, 1kg customization
  • HS Code: 3910000000
  • Application: Insulators, CPU Heat Sink, PCB Heat Sink, Computer Heat Sink
  • Chemistry: Heat Sink
  • Thermal Rating: H 180
  • Classification: Thermal Interface Material
  • Color: White, Gray
  • Viscosity: Customization
  • Export Lisence: Available
  • OEM: Available
  • Transport Package: Tube, Tank
  • Origin: China
Product Description
       Gray Color Thermal Silicone Grease Heat Sink Compound for Computer                 SPECIFICATION

                                 Thermal Conductive Silicon  Grease
Serial NumberDR3042Test Standard
ColorGray By sight
AppearancePasteBy sight
Viscosity49000mPa.sDJ-4
Rated Temperature-30-180ºCEN344
Density3.30g/ccASTM D792
Conductivity2.8W/mkASTM D5470
Heat Impedance  0.138ºC.2/WASTM D5470
Dielectric Strength≥5KV/mmASTM D149
Resistance6.2×1011Ω.cmASTM D257
Evaporation≤1%@120ºC 4hr
Solid Content99%@120ºC 4hr
Bleed0.22%@150ºC  7days
The properties is based on 25ºC 55% humidity

Features  

1 Thermal Conductivity: 2.8 W/m-K
2 Applies very low force on components during assembly
3 Low volumetric expansion
4 Excellent chemical and mechanical stability even at higher temperatures
5 No curing required
 

 Applications

  Bare die to heat spreader lid
  Filling various gaps between heat-generating devices to heat sinks and housings
  Devices requiring low assembly pressure
   

 
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