Gold Member Since 2017
Saftop Perindo (HK) Co., Limited

Silicone Grease, CPU Cooler, Heat Sink Paste manufacturer / supplier in China, offering Liquid Thermal Paste Silicone Grease Heat Sink Compound for CPU, Ultra Light Thermal Conductive Silicone Pad Heat Sink Gap Filler 4W for PCB, High Temperature Thermal Conductive Silicone Gap Pad for PCB and so on.

(/ )

Supplier Homepage Product Thermal paste Liquid Thermal Paste Silicone Grease Heat Sink Compound for CPU

Liquid Thermal Paste Silicone Grease Heat Sink Compound for CPU

FOB Price: US $0.6-30 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $0.6-30/ Piece
Get Latest Price
Port: Hong Kong, Hong Kong
Production Capacity: 1000 Ton/Month
Payment Terms: L/C, T/T, Western Union

Request a custom order and have something just for you!

Send Customized Request
Product Catalog
Thermal Grease
5 Products
Product Image
Product Name
FOB Price
Product Package
Product Attribute
Product Table
Basic Info
  • Model NO.: DR40 T14
  • Type: Liquid
  • Material: Rubber
  • Maximum Voltage: <10KV
  • Certification: UL, ISO9001
  • Brand: Saftop
  • MSDS: Availabe
  • Packing Weight: Customization
  • Trademark: Saftop or OEM
  • Specification: 10g, 50g, 0.5kg, 1kg customization
  • HS Code: 3910000000
  • Application: Insulators, CPU Heat Sink, PCB Heat Sink, Computer Heat Sink
  • Chemistry: Heat Sink
  • Thermal Rating: H 180
  • Classification: Thermal Interface Material
  • Color: White, Gray
  • Viscosity: Customization
  • Export Lisence: Available
  • OEM: Available
  • Transport Package: Tube, Tank
  • Origin: China
Product Description
                                 Thermal Conductive Silicon  Grease
Serial Number DR40 T14Test Standard
ColorGray By sight
AppearancePasteBy sight
Rated Temperature-30-180ºCEN344
Density3.03g/ccASTM D792
Conductivity4.0W/mkASTM D5470
Heat Impedance  0.835ºC.2/WASTM D5470
Dielectric Strength≥5KV/mmASTM D149
Resistance6.2×1011Ω.cmASTM D257
Evaporation≤1%@120ºC 4hr
Solid Content99%@120ºC 4hr
Bleed0.22%@150ºC  7days
The properties is based on 25ºC 55% humidity


1 Thermal Conductivity: 4.0 W/m-K
2 Applies very low force on components during assembly
3 Low volumetric expansion
4 Excellent chemical and mechanical stability even at higher temperatures
5 No curing required


   High performance computer processors (traditional screw fastening or clamping methods will
     provide adequate force to optimize the thermal performance of TICTM 4000)
  High watt density applications where the lowest thermal resistance interface is required

Liquid Thermal Paste Silicone Grease Heat Sink Compound for CPU
Send your message to this supplier
Mr. Liuanfei
To: Mr. Liuanfei

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

Find Similar Products By Category