Gold Member Since 2017
Saftop Perindo (HK) Co., Limited

Silicone Grease, CPU Compound, Heat Sink Paste manufacturer / supplier in China, offering Single Part Thermal Paste 4W for CPU RoHS No MOQ Original Manufacturer Silicone Grease Compound, Low Density Thermal Pad 4W for Electromobile Ts16949 RoHS Gap Pad Heat Transfer Pad ISO Manufacturer, Soft Thermal Conductive Silicone Gap Pad for PCB Original Manufacturer Silicone Pad Sil Pad and so on.

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Supplier Homepage Product Thermal paste Single Part Thermal Paste 4W for CPU RoHS No MOQ Original Manufacturer Silicone Grease Compound

Single Part Thermal Paste 4W for CPU RoHS No MOQ Original Manufacturer Silicone Grease Compound

FOB Price: US $0.64-31.9 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $0.64-31.9/ Piece
Get Latest Price
Port: Hong Kong, Hong Kong
Production Capacity: 1000 Ton/Month
Payment Terms: L/C, T/T, Western Union

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Product Catalog
Thermal Grease
5 Products
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FOB Price
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Basic Info
  • Model NO.: DR40 T14
  • Type: Liquid
  • Material: Rubber
  • Maximum Voltage: <10KV
  • Certification: UL, ISO9001
  • Brand: Saftop
  • MSDS: Availabe
  • Packing Weight: Customization
  • Trademark: Saftop or OEM
  • Specification: 10g, 50g, 0.5kg, 1kg customization
  • HS Code: 3910000000
  • Application: Insulators, CPU Heat Sink, PCB Heat Sink, Computer Heat Sink
  • Chemistry: Heat Sink
  • Thermal Rating: H 180
  • Classification: Thermal Interface Material
  • Color: White, Gray
  • Viscosity: Customization
  • Export Lisence: Available
  • OEM: Available
  • Transport Package: Tube, Tank
  • Origin: China
Product Description
                        SPECIFICATION
                                 Thermal Conductive Silicon  Grease
Serial Number DR40 T14Test Standard
ColorGray By sight
AppearancePasteBy sight
Viscosity250000mPa.sDJ-4
Rated Temperature-30-180ºCEN344
Density3.03g/ccASTM D792
Conductivity4.0W/mkASTM D5470
Heat Impedance  0.835ºC.2/WASTM D5470
Dielectric Strength≥5KV/mmASTM D149
Resistance6.2×1011Ω.cmASTM D257
Evaporation≤1%@120ºC 4hr
Solid Content99%@120ºC 4hr
Bleed0.22%@150ºC  7days
The properties is based on 25ºC 55% humidity



Features  

1 Thermal Conductivity: 4.0 W/m-K
2 Applies very low force on components during assembly
3 Low volumetric expansion
4 Excellent chemical and mechanical stability even at higher temperatures
5 No curing required
 

 Applications

   High performance computer processors (traditional screw fastening or clamping methods will
     provide adequate force to optimize the thermal performance of TICTM 4000)
  High watt density applications where the lowest thermal resistance interface is required
   

Single Part Thermal Paste 4W for CPU RoHS No MOQ Original Manufacturer Silicone Grease Compound
 
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