Gold Member Since 2017
Saftop Perindo (HK) Co., Limited

Silicone Sealant, Gap Filler, Potting Compound manufacturer / supplier in China, offering Thermal Silicone Sealant Potting Compund 1W for Leg Lighting, High Conductivity Ultra Thin Silicone Conductive Pad Gap Filler Thermal Conductive Pad for GPU, Ultra Light Thermal Silicone Conductive Pad Heat Sink Pad 4W for PCB and so on.

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Supplier Homepage Product Thermal sealant Thermal Silicone Sealant Potting Compund 1W for Leg Lighting

Thermal Silicone Sealant Potting Compund 1W for Leg Lighting

FOB Price: US $0.2-2.5 / Piece
Min. Order: 10 Pieces
Min. Order FOB Price
10 Pieces US $0.2-2.5/ Piece
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Production Capacity: 1000000000 Pieces Per Month
Transport Package: Tube, Tank in Carton on Pallet
Payment Terms: L/C, T/T, Western Union

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Basic Info
  • Model NO.: SR20T-T10
  • Application: Electronic Product, Lighting
  • Cross-Section Shape: Liquid
  • Harndness: Customization
  • Trademark: Saftop or OEM
  • Origin: China
  • Material: Silicone Rubber
  • Effect: Seal, Heat Sink
  • Viscosity: Customization
  • Packing Quantity: Customization
  • Specification: 15g, 50g, 5~20kg
  • HS Code: 3910000000
Product Description
ItemB
AppearanceBlackWhite
Density1.6±0.05 g/cm³1.6±0.05 g/cm³
Viscosity3500±500 Mpa.s3500±500 Mpa.s
Two components1:1
Color after MixBlack
Viscosityafter Mix2200±600
Operation time after Mix60-100min at 25ºC
Initial Cured Time4h at 25ºC
Fully Cured Time8h at 25ºC
Fully Cured Time20min at 80ºC
Tensile Strength after Cured<1 Mpa
Elogation after Cured≥60%
Harndss Cured Shore A50±5
Shear Strength after Cured≥1 Mpa
Rated Temperature-60~220 ºC
Flame ResistanceUL94 V0
Thermal Conductivity1W/m.k
The properties is based on 25ºC 55% humidity



 Features
1 Thermal conductivity: 1 W/m-K
2 No silicone outgassing or extraction
3 Ultra-conforming, designed for fragile and low-stress applications
4 Ambient and accelerated cure schedules
5 100% solids - no cure by-products


Applications 

  Silicone-sensitive optic components   Hard disk assemblies
  Silicone-sensitive electronics        Dielectric for bare-leaded devices
  Filling gaps to heat sinks and housings
  
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